Static-Sensitive Devices (SSDs): How Electrostatic Discharge (ESD) Threatens Modern Electronics Manufacturing. How Sierra Electronics Prevents It?

Static-sensitive devices (SSDs) and ESD Risk in High-Reliability Manufacturing

Static-sensitive devices (SSDs) are at the heart of today’s aerospace, defense, automotive, and high-reliability electronics. These ESD-sensitive components — microprocessors, memory ICs, RF modules, imaging sensors, and precision analog devices — can be damaged by electrostatic charge transfers as low as 3–30 volts, far below human perception.

This is why every SMT manufacturer now prioritizes electrostatic discharge prevention, ESD-safe SMT packaging, and ANSI/ESD S20.20 compliant workflows, especially when handling partial reels, feeder loading operations, and repackaged components.

For factories running DigiReel®, MouseReel®, or high-speed dual-lane pick-and-place platforms, the difference between stable uptime and catastrophic latent failures often comes down to the quality of the SMT splicing, leader materials, and ESD packaging used at the handoff point.

Sierra Electronics – the SMT splice tape manufacturer in the USA — designs its products to eliminate this risk across every touchpoint.

Static-sensitive devices are electronic components susceptible to damage from electrostatic charge transfer. ESD damage occurs when charge stored on a person, surface, or tool discharges rapidly into an exposed component.

These devices include:

• Microprocessors and microcontrollers
• DRAM / SRAM / Flash memory
• Integrated circuits (ICs) & SoCs
• CCDs, CMOS sensors
• Laser diodes and RF chips
• Ultra-fine-geometry aerospace electronics

Because these components use nanometer-scale gates, the wrong surface resistivity, static decay rate, or static charge accumulation on PET films during packaging can lead to catastrophic, parametric, or latent damage.

How ESD Damages SMT Components

1. Catastrophic Failure
   Immediate failure during test or SMT placement.
2. Parametric Failure
   Performance drifts outside tolerance — common in ADCs/DACs, RF parts, and timing components.
3. Latent Failure
   The most expensive: the device passes final test but fails months later in the field. This is exactly how latent ESD failure occurs in microprocessors and critical ICs used in aerospace and defense electronics.

Preventing these failure modes requires proper SMT packaging, verified ESD-safe component trays, and compliant dissipative packaging — all core strengths of Sierra Electronics.

Where SMT Packaging Creates Hidden ESD Risk

• Partial reels used by component distributors
  Distributors commonly attach leader tape extenders or repack components into DigiReels / MouseReels. When they use cheap, static-unsafe PET films, feeder loading risk spikes.
• Reel changes during production
  Operators often handle exposed components when changing reels, especially when using double-sided splice tape or generic feeder splice tools.
• Feeder acceleration at high-speed placement
  If cover tape adhesion strength is inconsistent — common with non-compliant imports — charge can build up on the PET layer, causing discharge into the first components picked.