Pressure Sensitive Cover Tape

SKU N/A Category Cover Tape

The Pressure Sensitive Cover Tape is a high-quality sealing solution designed for securing electronic components in carrier tapes without the need for heat activation.

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Pressure Sensitive Cover Tape Description

Pressure Sensitive Cover Tape is a high-performance sealing solution that is designed to keep electronic components encapsulated in carrier tapes without heat activation. It is pressure-sensitive adhesive-based, which provides a hard and consistent bond to maintain surface-mount devices (SMDs) in a stable condition during shipping, storage, and automated assembly.

This clear cover tape is widely used in tape-and-reel packaging for high transparency to permit clear viewing of components in electronics production. It is applicable for use with numerous carrier tape materials and is also available in electrostatic discharge (ESD) protective grades for electronic component handling when sensitivity is a concern. Its ease of application and its consistent sealing characteristics make it a required choice for PCB assembly, semiconductor packaging, and automated component feeding.

Application Examples

Surface Mount Device (SMD) Packaging: The tape rolls that have microchips, resistors, capacitors, etc., are sealed well in SMD packaging for automated assembly.
Printed Circuit Board (PCB) Manufacturing: The proper protection and spacing of electronic components ensure their exact location during the PCB assembly process.
Semiconductor Packaging: The semiconductor components that have been employed in different electronic devices are kept safe and transported.
Light Emitting Diode (LED) and Optoelectronic Component Packaging: LED chip, optical sensors, and other light-sensitive components are well sealed within the packaging material.
Automotive Electronics Production: Utilized in packaging sensors, microcontrollers, and other essential automotive electronic components.
Medical Device Assembly: Shields electronic components applied in medical devices like diagnostic tools and wearable health monitors.
Consumer Electronics Production: Utilized in the production of smartphones, tablets, laptops, and other consumer electronic products.
Telecommunications Equipment Manufacturing: Facilitates secure packaging of microprocessors, RF modules, and other communication-related parts.
Industrial Automation Systems: Supports packaging electronic components used in robotics, control systems, and automated devices.
Aerospace and Defense Electronics: Provides reliable sealing for precision electronic components used in avionics and defense systems.

Pressure Sensitive Cover Tape Features

Strong Pressure-Sensitive Adhesive – Provides a secure and reliable bond without requiring heat activation.
Clear Visibility – Transparent material allows easy inspection of components within the carrier tape.
ESD Protection Options – Available in electrostatic discharge (ESD) safe versions to protect sensitive electronic components.
Compatible with Various Carrier Tapes – Works with a wide range of carrier tape materials for different packaging needs.
Consistent Peel Force – Ensures smooth and controlled removal for automated pick-and-place assembly.
Durable and Flexible – Maintains adhesion during transport, storage, and handling without becoming brittle.
Moisture and Contaminant Resistance – Helps protect components from environmental factors.
Wide Application Range – Suitable for SMD packaging, PCB assembly, semiconductor handling, and more.
Easy Application – Simple to use in automated or manual taping processes, reducing production downtime.
High Reliability – Designed to meet industry standards for electronic component packaging.

Pressure Sensitive Cover Tape FAQs

1. What is Pressure Sensitive Cover Tape used for?

It is used to seal carrier tapes containing electronic components such as SMDs, ensuring they remain securely in place during transport, storage, and automated assembly.

2. How does Pressure Sensitive Cover Tape work?

The tape has a pressure-sensitive adhesive that bonds to carrier tapes upon application of pressure, eliminating the need for heat activation.

3. Is this tape compatible with all carrier tapes?

Yes, it is designed to work with various carrier tape materials, including polystyrene and polycarbonate, making it suitable for different electronic component packaging needs.

4. Does this tape provide ESD protection?

Yes, ESD-safe versions are available to protect sensitive electronic components from electrostatic discharge.

5. Can this tape be removed and reapplied?

No, once applied, it forms a secure bond and is not designed for reuse or reapplication.

6. What widths are available for this tape?

It comes in multiple widths to accommodate different carrier tape sizes, ensuring compatibility with various packaging requirements.

Related
Products

Heat Seal Cover Tape

Details

We have manufactured a full range of high quality SMT Splicing Products for the contract and OEM manufacturing industry since 1998. Professional excellence is our game and we are committed to ongoing improvements in all aspects of the business.

Shipping

We are the only tape splicing manufacturer in the United States and our headquarter location in beautiful Santa Fe, New Mexico allows us to meet tight delivery requirements to anywhere in North America.

Return Policy

We strive to ensure customer satisfaction with every purchase. If you are not fully satisfied with your order, you may return unused products in their original packaging. Please contact our customer service team to initiate the return process.